SiO2/Si界面As堆积的表征

C. Steen, A. Martinez-Limia, P. Pichler, H. Ryssel, Lirong Pei, G. Duscher, W. Windl
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引用次数: 4

摘要

利用掠入射x射线荧光光谱法研究了SiO2/Si界面As的堆积,并结合刻蚀去除纳米级厚度的硅层。为了确定在界面处去除的硅层的厚度,原子力显微镜对沟槽结构进行了测量。利用这种方法,可以确定硅中堆积区域的厚度。此外,在从3middot1012 cm-2到1middot10-16 cm-2的较大注入剂量范围内,可以清楚地区分分离原子和体中的As原子。样品分别在900°c和1000°c退火,时间足够长,以确保偏析反映平衡效应。利用这种方法,以新的精度测量了原子的堆积。
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Characterization of the pile-up of As at the SiO2/Si interface
The pile up of As at the SiO2/Si interface was investigated by grazing incidence X-ray fluorescence spectroscopy in combination with removal of silicon layers by etching with thicknesses on the order of a nanometer. In order to determine the thickness of the silicon layers removed at the interface, atomic force microscope measurements were performed at trench structures. With this method, it is possible to determine the thickness of the piled-up region in the silicon. In addition, it is possible to clearly distinguish between the segregated atoms and the As atoms in the bulk over a large range of implantation doses from 3middot1012 cm-2 to 1middot10-16 cm-2. The samples were annealed at 900degC and 1000degC, respectively, for times sufficiently long to ensure that the segregation reflects an equilibrium effect. With this approach, the pile-up of As was measured with new precision.
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