碳纳米管作为互连:新兴技术和潜在的可靠性问题

2008 IEEE International Reliability Physics Symposium Pub Date : 2008-07-09 DOI:10.1109/RELPHY.2008.4558914

Carl V. Thompson

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引用次数: 8

摘要

利用碳纳米管(CNTs)替代或补充铜基集成电路互连正受到广泛的研究。碳纳米管具有低电阻率，可以配置为具有低电容耦合，并且化学性质稳定，因此不需要扩散屏障。它们也可以携带非常高的电流密度而不会损坏。综述了用于集成电路互连的碳纳米管的性能和工艺，并讨论了新兴技术和可能的可靠性问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Carbon nanotubes as interconnects: Emerging technology and potential reliability issues

The use of carbon nanotubes (CNTs) to replace or complement Cu-based IC interconnects is under wide-spread investigation. CNTs have low resistivities and can be configured to have low capacitive coupling, and are also chemically stable so that diffusion barriers are not needed. They can also carry very high current densities without damage. Properties and processing of CNTs for IC interconnects are reviewed and emerging technologies and possible reliability issues are discussed.

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2008 IEEE International Reliability Physics Symposium

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