原子力显微镜在半导体器件和封装表征中的应用

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 1997-07-21 DOI:10.1109/IPFA.1997.638349

M. Natarajan, C. Q. Cui, D.P. Poener, M. Radhakrishnan

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摘要

本文介绍了对半导体器件和封装相关材料进行的几个案例研究的结果。重点是扫描探针显微镜(SPM)技术的新应用，而不是传统的分析。并简要讨论了功率谱密度和总表面积这两个表面形貌参数在SPM中的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Applications of atomic force microscopy for semiconductor device and package characterization

This paper presents the results of a few case studies carried out on semiconductor devices and packaging related materials. The emphasis is on the novel application of Scanning Probe Microscopy (SPM) techniques as compared to the traditional analysis. Also, application of two surface topography parameters of SPM, power spectral density and total surface area are briefly discussed.

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Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

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