E. Jones, Fred Wang, D. Costinett, Zheyu Zhang, Ben Guo
{"title":"GaN hfet的温度依赖性导通损耗分析","authors":"E. Jones, Fred Wang, D. Costinett, Zheyu Zhang, Ben Guo","doi":"10.1109/APEC.2016.7467994","DOIUrl":null,"url":null,"abstract":"Enhancement-mode GaN HFETs enable efficient high-frequency converter design, but this technology is relatively new and exhibits different characteristics from Si or SiC MOSFETs. GaN performance at elevated temperature is especially unique. Turn-on time increases significantly with temperature, and turn-on losses increase as a result. This phenomenon can be explained based on the relationships between junction temperature and GaN device transconductance, and between transconductance and turn-on time. An analytical relationship between temperature and turn-on loss has been derived for the 650-V GS66508 from GaN Systems, and verified with experimental results. Based on this relationship, a detailed model is developed, and a simplified scaling factor is proposed for estimating turn-on loss in e-mode GaN HFETs, using room-temperature switching characterization and typically published datasheet parameters.","PeriodicalId":143091,"journal":{"name":"2016 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"36","resultStr":"{\"title\":\"Temperature-dependent turn-on loss analysis for GaN HFETs\",\"authors\":\"E. Jones, Fred Wang, D. Costinett, Zheyu Zhang, Ben Guo\",\"doi\":\"10.1109/APEC.2016.7467994\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Enhancement-mode GaN HFETs enable efficient high-frequency converter design, but this technology is relatively new and exhibits different characteristics from Si or SiC MOSFETs. GaN performance at elevated temperature is especially unique. Turn-on time increases significantly with temperature, and turn-on losses increase as a result. This phenomenon can be explained based on the relationships between junction temperature and GaN device transconductance, and between transconductance and turn-on time. An analytical relationship between temperature and turn-on loss has been derived for the 650-V GS66508 from GaN Systems, and verified with experimental results. Based on this relationship, a detailed model is developed, and a simplified scaling factor is proposed for estimating turn-on loss in e-mode GaN HFETs, using room-temperature switching characterization and typically published datasheet parameters.\",\"PeriodicalId\":143091,\"journal\":{\"name\":\"2016 IEEE Applied Power Electronics Conference and Exposition (APEC)\",\"volume\":\"85 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-03-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"36\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Applied Power Electronics Conference and Exposition (APEC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEC.2016.7467994\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.2016.7467994","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature-dependent turn-on loss analysis for GaN HFETs
Enhancement-mode GaN HFETs enable efficient high-frequency converter design, but this technology is relatively new and exhibits different characteristics from Si or SiC MOSFETs. GaN performance at elevated temperature is especially unique. Turn-on time increases significantly with temperature, and turn-on losses increase as a result. This phenomenon can be explained based on the relationships between junction temperature and GaN device transconductance, and between transconductance and turn-on time. An analytical relationship between temperature and turn-on loss has been derived for the 650-V GS66508 from GaN Systems, and verified with experimental results. Based on this relationship, a detailed model is developed, and a simplified scaling factor is proposed for estimating turn-on loss in e-mode GaN HFETs, using room-temperature switching characterization and typically published datasheet parameters.