{"title":"微芯片上键垫变色的研究与消除","authors":"H. Younan, C. Eddy, S. Redkar","doi":"10.1109/SMELEC.2002.1217847","DOIUrl":null,"url":null,"abstract":"In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.","PeriodicalId":211819,"journal":{"name":"ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Investigation and elimination of discolored bondpads on microchip\",\"authors\":\"H. Younan, C. Eddy, S. Redkar\",\"doi\":\"10.1109/SMELEC.2002.1217847\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.\",\"PeriodicalId\":211819,\"journal\":{\"name\":\"ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-12-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMELEC.2002.1217847\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMELEC.2002.1217847","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigation and elimination of discolored bondpads on microchip
In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.