一种提高芯芯电阻缺陷容错性的三端口寄存器文件设计

Lushan Liu, R. Sridhar, S. Upadhyaya
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引用次数: 1

摘要

由于静态随机存取存储器(SRAM)运行速度快,所以通常使用它来实现寄存器文件。此外,基于sram的多端口寄存器文件可以同时执行多个读写操作,从而提高了嵌入式系统的数据吞吐量,满足了并行或流水线微处理器的预期需求。随着晶体管特征尺寸的不断缩小,为微处理器设计低功耗鲁棒寄存器文件并研究其失效特性变得至关重要。在这项工作中,作者提出了一种具有3端口SRAM单元结构的寄存器文件和用于读电路的差分电流模式检测放大器。研究了SRAM单元内电阻性缺陷的故障模型及其故障边界。通过不同端口数的同时读操作,在故障单元上测试了多端口存储器的读干扰故障。实验结果表明,与采用0.18 ma制造工艺技术的电压模式检测相比,该电流模式检测方案对电阻性缺陷的记忆容错能力在双端口读取时提高了4-6倍,在三端口读取时提高了5.8倍
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A 3-port Register File Design for Improved Fault Tolerance on Resistive Defects in Core-Cells
Register file is often implemented using static random access memory (SRAM) due to its fast operation. Furthermore, SRAM-based multi-port register file can perform multiple read and write operations simultaneously, thus increasing data throughput in embedded systems and meeting the expected demands of parallel or pipelined microprocessors. With the continuous scaling of transistor feature size, designing low power robust register file for microprocessors and investigating their failure characteristics become critical. In this work, the authors present a register file with a structure of 3-port SRAM cell and a differential current-mode sense amplifier for read circuitry. The authors then study the fault models for resistive defect within the SRAM cell and its failure boundary. A read disturb fault for multi-port memories is tested on the faulty cell by simultaneous read operations with different numbers of ports. Experimental results show that the proposed current-mode sensing scheme has improvements for memory fault-tolerance of resistive defect at 4-6times for dual-port read and 5.8times for 3-port read compared to voltage-mode sensing with 0.18mum manufacturing process technology
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