Tomoko Takahashi, H. Inoue, Takahiro Yada, Naoki Hayashi, Yukari Imaizumi, Y. Ikemoto, Shigenori Sawachi, Atsushi Furuno, K. Yoshimitsu, M. Ooida, Akio Katsumata, Y. Hiruta
{"title":"一个新的嵌入式芯片封装- WFOP™","authors":"Tomoko Takahashi, H. Inoue, Takahiro Yada, Naoki Hayashi, Yukari Imaizumi, Y. Ikemoto, Shigenori Sawachi, Atsushi Furuno, K. Yoshimitsu, M. Ooida, Akio Katsumata, Y. Hiruta","doi":"10.1109/ESTC.2014.6962743","DOIUrl":null,"url":null,"abstract":"A new package structure and technology for the next generation of embedded-die package named as WFOP™ (Wide panel Fan-Out Package) was developed. It's a facedown mounting type, using metal plate as the base plate of its redistributed layer. Manufacturing is done not in wafer scale, but in large scale panel substrate. The structure, process, reliability results, and some performance are introduced. The package assembly technology for WFOP is using die-embedding method. So the technology is also able to apply to 3D packages. Some experience of 3D packages is shown in this paper. This technology will be expected to lead a new packaging technology for the next generation.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A new embedded die package — WFOP™\",\"authors\":\"Tomoko Takahashi, H. Inoue, Takahiro Yada, Naoki Hayashi, Yukari Imaizumi, Y. Ikemoto, Shigenori Sawachi, Atsushi Furuno, K. Yoshimitsu, M. Ooida, Akio Katsumata, Y. Hiruta\",\"doi\":\"10.1109/ESTC.2014.6962743\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new package structure and technology for the next generation of embedded-die package named as WFOP™ (Wide panel Fan-Out Package) was developed. It's a facedown mounting type, using metal plate as the base plate of its redistributed layer. Manufacturing is done not in wafer scale, but in large scale panel substrate. The structure, process, reliability results, and some performance are introduced. The package assembly technology for WFOP is using die-embedding method. So the technology is also able to apply to 3D packages. Some experience of 3D packages is shown in this paper. This technology will be expected to lead a new packaging technology for the next generation.\",\"PeriodicalId\":299981,\"journal\":{\"name\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2014.6962743\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962743","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new package structure and technology for the next generation of embedded-die package named as WFOP™ (Wide panel Fan-Out Package) was developed. It's a facedown mounting type, using metal plate as the base plate of its redistributed layer. Manufacturing is done not in wafer scale, but in large scale panel substrate. The structure, process, reliability results, and some performance are introduced. The package assembly technology for WFOP is using die-embedding method. So the technology is also able to apply to 3D packages. Some experience of 3D packages is shown in this paper. This technology will be expected to lead a new packaging technology for the next generation.
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