嵌入式处理器的温度感知调度

R. Jayaseelan, T. Mitra
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引用次数: 21

摘要

在最近几代处理器中,功率密度一直在以惊人的速度增长,导致芯片上的温度很高。温度越高,可靠性越差,漏电流越大。本文提出了一种嵌入式多任务系统的温度感知调度技术。我们观察到,在不同的嵌入式应用的热性能有很高的可变性。我们设计了温度感知调度(TAS)方案,利用这种可变性来保持系统温度低于期望水平,同时满足诸如吞吐量,公平性和实时约束等许多要求。此外,TAS可以探索温度约束系统中吞吐量和公平性之间的权衡。与具有响应性硬件级热管理的标准调度器相比,TAS提供了更好的吞吐量,对公平性的影响可以忽略不计。
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Temperature Aware Scheduling for Embedded Processors
Power density has been increasing at an alarming rate in recent processor generations resulting in high on-chip temperature. Higher temperature results in poor reliability and increased leakage current. In this paper, we propose a temperature aware scheduling technique in the context of embedded multi-tasking systems. We observe that there is a high variability in the thermal properties of different embedded applications. We design temperature-aware scheduling(TAS) scheme that exploits this variability to maintain the system temperature below a desired level while satisfying a number of requirements such as throughput, fairness and real time constraints. Moreover, TAS enables exploration of the tradeoffs between throughput and fairness in temperature-constrained systems. Compared against standard schedulers with reactive hardware-level thermal management, TAS provides better throughput with negligible impact on fairness.
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