通过PEEC生成降阶模型，用于捕获皮肤和接近效果

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634084

M. Kamon, N. Marques, L. M. Silveira, Jacob K. White

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引用次数: 23

摘要

过去，模型阶数降阶技术已经成功地应用于三维PEEC(部分元件等效电路)互连模型。本文探讨了当类peec模型包含体积细丝以准确捕获皮肤和邻近效应时，生成低阶模型的困难。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Generating reduced order models via PEEC for capturing skin and proximity effects

In the past, model order reduction techniques have been successfully employed for 3-D PEEC (Partial Element Equivalent Circuit) interconnect models. This paper explores the difficulties in generating low order models when PEEC-like models include volume filaments to accurately capture skin and proximity effects.

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Electrical Performance of Electronic Packaging

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