Aylin Bicakci, Ronald Eisele, F. Osterwald, K. Olesen
{"title":"有机基片与陶瓷基片绝缘的比较","authors":"Aylin Bicakci, Ronald Eisele, F. Osterwald, K. Olesen","doi":"10.1109/ESTC.2014.6962859","DOIUrl":null,"url":null,"abstract":"A study and comparison of substrates with ceramic and organic electrically insulating and thermally conductive layers for power electronic packages is presented. Reference is made to the “die on leadframe”-technology, to compare these structures with a commercial ceramic substrate. The focus of the study is on the thermal properties of the structures. Furthermore, a comprehensive overview of test methods and results for the breakdown voltage and the sheer strengths of the tested organic layers is given. The test results will be evaluated, if organic layers could be used as a substitute for standard ceramic substrates.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Comparison between organic and ceramic substrate insulation\",\"authors\":\"Aylin Bicakci, Ronald Eisele, F. Osterwald, K. Olesen\",\"doi\":\"10.1109/ESTC.2014.6962859\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A study and comparison of substrates with ceramic and organic electrically insulating and thermally conductive layers for power electronic packages is presented. Reference is made to the “die on leadframe”-technology, to compare these structures with a commercial ceramic substrate. The focus of the study is on the thermal properties of the structures. Furthermore, a comprehensive overview of test methods and results for the breakdown voltage and the sheer strengths of the tested organic layers is given. The test results will be evaluated, if organic layers could be used as a substitute for standard ceramic substrates.\",\"PeriodicalId\":299981,\"journal\":{\"name\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2014.6962859\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962859","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Comparison between organic and ceramic substrate insulation
A study and comparison of substrates with ceramic and organic electrically insulating and thermally conductive layers for power electronic packages is presented. Reference is made to the “die on leadframe”-technology, to compare these structures with a commercial ceramic substrate. The focus of the study is on the thermal properties of the structures. Furthermore, a comprehensive overview of test methods and results for the breakdown voltage and the sheer strengths of the tested organic layers is given. The test results will be evaluated, if organic layers could be used as a substitute for standard ceramic substrates.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
