{"title":"晶圆键合工具，包括双等离子体能力，在对准键合之前进行原位溅射蚀刻","authors":"T. Rogers, V. Masteika, R. Santilli","doi":"10.23919/LTB-3D.2017.7947405","DOIUrl":null,"url":null,"abstract":"Surface passivation free direct bonding is emerging as an important wafer bonding technique. We present an innovative approach to removing passivation layers and bonding in a single tool via simultaneous dual plasma treatment.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"150 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wafer bonding tool including dual plasma capability for in-situ sputter etching prior to aligned bonding\",\"authors\":\"T. Rogers, V. Masteika, R. Santilli\",\"doi\":\"10.23919/LTB-3D.2017.7947405\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Surface passivation free direct bonding is emerging as an important wafer bonding technique. We present an innovative approach to removing passivation layers and bonding in a single tool via simultaneous dual plasma treatment.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"150 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947405\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947405","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Wafer bonding tool including dual plasma capability for in-situ sputter etching prior to aligned bonding
Surface passivation free direct bonding is emerging as an important wafer bonding technique. We present an innovative approach to removing passivation layers and bonding in a single tool via simultaneous dual plasma treatment.
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