{"title":"用于瞬态仿真的MOS模型","authors":"Maryam Hajimiri, J. Schutt-Ainé","doi":"10.1109/EDAPS.2016.7874438","DOIUrl":null,"url":null,"abstract":"This paper presents an approach for the transient simulation of circuits through the latency insertion model using advanced models for MOS transistors. By taking into account the dynamic charge storage effects in short-channel devices a more accurate simulation of high-speed digital and analog circuits via the latency insertion method can be performed. The approach makes use of the SPICE LEVEL 3 transistor model for MOSFETs. In addition the use of the latency insertion method allows better convergence and higher computational speed for the simulation. Several computer simulations are performed to validate the method. Results show improvement in accuracy by using the high-level models.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"135 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"MOS models for LIM transient simulations\",\"authors\":\"Maryam Hajimiri, J. Schutt-Ainé\",\"doi\":\"10.1109/EDAPS.2016.7874438\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an approach for the transient simulation of circuits through the latency insertion model using advanced models for MOS transistors. By taking into account the dynamic charge storage effects in short-channel devices a more accurate simulation of high-speed digital and analog circuits via the latency insertion method can be performed. The approach makes use of the SPICE LEVEL 3 transistor model for MOSFETs. In addition the use of the latency insertion method allows better convergence and higher computational speed for the simulation. Several computer simulations are performed to validate the method. Results show improvement in accuracy by using the high-level models.\",\"PeriodicalId\":191549,\"journal\":{\"name\":\"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"135 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2016.7874438\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2016.7874438","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper presents an approach for the transient simulation of circuits through the latency insertion model using advanced models for MOS transistors. By taking into account the dynamic charge storage effects in short-channel devices a more accurate simulation of high-speed digital and analog circuits via the latency insertion method can be performed. The approach makes use of the SPICE LEVEL 3 transistor model for MOSFETs. In addition the use of the latency insertion method allows better convergence and higher computational speed for the simulation. Several computer simulations are performed to validate the method. Results show improvement in accuracy by using the high-level models.