SOI mosfet热载流子退化的数值模拟

Qing Lin, M. Zhu, Yan-jun Wu, Xinyun Xie, Zhengxuan Zhang, Cheng-lu Lin
{"title":"SOI mosfet热载流子退化的数值模拟","authors":"Qing Lin, M. Zhu, Yan-jun Wu, Xinyun Xie, Zhengxuan Zhang, Cheng-lu Lin","doi":"10.1109/IWJT.2004.1306855","DOIUrl":null,"url":null,"abstract":"We present a simulation-based approach for characterizing hot-carrier degradation in SOI MOSFETs, which includes models for hot-carrier injection, carrier transport, and carrier trapping in the gate oxide. This approach clearly illustrates the physical mechanisms responsible for hot-carrier degradation in SOI MOSFETs. To suppress the hot-carrier effect, we have also proposed the SOI LDDMOSFET structure and the simulation results have been compared with each other.","PeriodicalId":342825,"journal":{"name":"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Numerical simulation of hot-carrier degradation in SOI MOSFETs\",\"authors\":\"Qing Lin, M. Zhu, Yan-jun Wu, Xinyun Xie, Zhengxuan Zhang, Cheng-lu Lin\",\"doi\":\"10.1109/IWJT.2004.1306855\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a simulation-based approach for characterizing hot-carrier degradation in SOI MOSFETs, which includes models for hot-carrier injection, carrier transport, and carrier trapping in the gate oxide. This approach clearly illustrates the physical mechanisms responsible for hot-carrier degradation in SOI MOSFETs. To suppress the hot-carrier effect, we have also proposed the SOI LDDMOSFET structure and the simulation results have been compared with each other.\",\"PeriodicalId\":342825,\"journal\":{\"name\":\"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWJT.2004.1306855\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWJT.2004.1306855","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

我们提出了一种基于模拟的方法来表征SOI mosfet中的热载子降解,包括热载子注入、载流子输运和载流子在栅极氧化物中的捕获模型。这种方法清楚地说明了SOI mosfet中热载流子退化的物理机制。为了抑制热载子效应,我们还提出了SOI LDDMOSFET结构,并对仿真结果进行了对比。
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Numerical simulation of hot-carrier degradation in SOI MOSFETs
We present a simulation-based approach for characterizing hot-carrier degradation in SOI MOSFETs, which includes models for hot-carrier injection, carrier transport, and carrier trapping in the gate oxide. This approach clearly illustrates the physical mechanisms responsible for hot-carrier degradation in SOI MOSFETs. To suppress the hot-carrier effect, we have also proposed the SOI LDDMOSFET structure and the simulation results have been compared with each other.
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