微机械像素阵列集成与CMOS红外应用

B. Cole, R. Higashi, R. Wood
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引用次数: 8

摘要

小型微机械结构的大型阵列,具有低热质量和低热导率,位于硅CMOS衬底之上,可作为(1)灵敏的非冷却红外相机或(2)高温红外投影仪。具有高热质量的小型薄微机械结构阵列,通过与具有高导热性的衬底极好地热隔离的支撑体悬浮在底层硅衬底之上。这种高热隔离允许用小电流(微发射器的情况)或少量红外(IR)入射通量(微辐射热计)对微结构进行有效加热。低质量保证了尽管电导低,热时间常数在毫秒范围内。我们展示了微辐射热计和微发射器共同的基本微观结构设计。
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Micromachined pixel arrays integrated with CMOS for infrared applications
Large arrays of small micromachined structures with low thermal mass and low thermal-conductance above silicon CMOS substrates and operate as (1) sensitive uncooled IR cameras or (2) high-temperature IR projectors. Arrays of small thin micromachined structures with high thermal masses, are suspended above the underlying silicon substrate by supports that are extremely well thermally isolated from the substrate with a high thermal conductance. This high thermal isolation allows for efficient heating of the microstructure with small currents (the case for microemitters), or small amounts of infrared (IR) incident flux (for microbolometers). The low mass ensures that despite the low conductance, the thermal time constants are in the millisecond range. We show the basic microstructure design common to both microbolometers and microemitters.
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