H.M. Zhou, B. Shen, D.J. Chen, N. Tang, T.S. Chen, G. Jiao, L. Ru, R. Zhang, Y. Shi, Y.D. Zheng
{"title":"Al/sub x/Ga/sub 1-x/N/GaN异质结构的Ti/Al/Ni/Au和Ti/Al/Pt/Au多层欧姆接触","authors":"H.M. Zhou, B. Shen, D.J. Chen, N. Tang, T.S. Chen, G. Jiao, L. Ru, R. Zhang, Y. Shi, Y.D. Zheng","doi":"10.1109/IWJT.2004.1306788","DOIUrl":null,"url":null,"abstract":"The ohmic contacts of Ti/Al/Ni/Au and Ti/Al/Pt/Au multi-layer on unintentionally-doped Al/sub 0.22/Ga/sub 0.78/N/GaN heterostructures have been investigated. The specific contact resistivities of 1.26/spl times/10/sup -6/ /spl Omega//spl middot/cm/sup 2/ for Ti/Al/Ni/Au contact and 1.97 /spl times/ 10/sup -5/ /spl Omega//spl middot/cm/sup 2/ for Ti/Al/Pt/Au contact were obtained. It is found that the Pt element in Ti/Al/Pt/Au multi-layer influent the diffusion of Al atom into the Au layer, which results in the higher contact resistivity of Ti/Al/Pt/Au contact than that of Ti/Al/Ni/Au one. The formation of excellent ohmic contact on the Al/sub 0.22/Ga/sub 0.78/N/GaN heterostructures is attributed to the existing of a compatible barrier between the metal electrode and the carrier channel at the Al/sub 0.22/Ga/sub 0.78/N/GaN hetero-interface. The width of the barrier depends on the annealing temperature and duration.","PeriodicalId":342825,"journal":{"name":"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Ti/Al/Ni/Au and Ti/Al/Pt/Au multi-layer ohmic contacts on Al/sub x/Ga/sub 1-x/N/GaN heterostructures\",\"authors\":\"H.M. Zhou, B. Shen, D.J. Chen, N. Tang, T.S. Chen, G. Jiao, L. Ru, R. Zhang, Y. Shi, Y.D. Zheng\",\"doi\":\"10.1109/IWJT.2004.1306788\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The ohmic contacts of Ti/Al/Ni/Au and Ti/Al/Pt/Au multi-layer on unintentionally-doped Al/sub 0.22/Ga/sub 0.78/N/GaN heterostructures have been investigated. The specific contact resistivities of 1.26/spl times/10/sup -6/ /spl Omega//spl middot/cm/sup 2/ for Ti/Al/Ni/Au contact and 1.97 /spl times/ 10/sup -5/ /spl Omega//spl middot/cm/sup 2/ for Ti/Al/Pt/Au contact were obtained. It is found that the Pt element in Ti/Al/Pt/Au multi-layer influent the diffusion of Al atom into the Au layer, which results in the higher contact resistivity of Ti/Al/Pt/Au contact than that of Ti/Al/Ni/Au one. The formation of excellent ohmic contact on the Al/sub 0.22/Ga/sub 0.78/N/GaN heterostructures is attributed to the existing of a compatible barrier between the metal electrode and the carrier channel at the Al/sub 0.22/Ga/sub 0.78/N/GaN hetero-interface. The width of the barrier depends on the annealing temperature and duration.\",\"PeriodicalId\":342825,\"journal\":{\"name\":\"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWJT.2004.1306788\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWJT.2004.1306788","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Ti/Al/Ni/Au and Ti/Al/Pt/Au multi-layer ohmic contacts on Al/sub x/Ga/sub 1-x/N/GaN heterostructures
The ohmic contacts of Ti/Al/Ni/Au and Ti/Al/Pt/Au multi-layer on unintentionally-doped Al/sub 0.22/Ga/sub 0.78/N/GaN heterostructures have been investigated. The specific contact resistivities of 1.26/spl times/10/sup -6/ /spl Omega//spl middot/cm/sup 2/ for Ti/Al/Ni/Au contact and 1.97 /spl times/ 10/sup -5/ /spl Omega//spl middot/cm/sup 2/ for Ti/Al/Pt/Au contact were obtained. It is found that the Pt element in Ti/Al/Pt/Au multi-layer influent the diffusion of Al atom into the Au layer, which results in the higher contact resistivity of Ti/Al/Pt/Au contact than that of Ti/Al/Ni/Au one. The formation of excellent ohmic contact on the Al/sub 0.22/Ga/sub 0.78/N/GaN heterostructures is attributed to the existing of a compatible barrier between the metal electrode and the carrier channel at the Al/sub 0.22/Ga/sub 0.78/N/GaN hetero-interface. The width of the barrier depends on the annealing temperature and duration.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
