准确地去除测试板对背板连接器高频特性的影响

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634065

S. Sercu, L. Martens

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引用次数: 11

摘要

本文研究了多针背板连接器高频固有特性的确定。内在特性是指连接器在没有组件板或背板的情况下的特性(s参数)。该连接器模型与通孔连接器无关，可用于任意元件板和背板的系统仿真。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors

This paper investigates the determination of the intrinsic high-frequency characteristics of a multi-pin backplane connector. The intrinsic characteristics are the characteristics (S-parameters) of the connector without the presence of a component board or a backplane on which it must be mounted. The connector model, which is independent of the connector via holes, can be used in system simulations with arbitrary component boards and backplanes.

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Electrical Performance of Electronic Packaging

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