H. Matsushita, K. Mitsutake, Y. Arakawa, T. Ishibumi, Y. Ushiku
{"title":"针对光刻相关故障的高灵敏度检测系统中的敏捷晶圆厂检测算法、良率影响的监测与评估","authors":"H. Matsushita, K. Mitsutake, Y. Arakawa, T. Ishibumi, Y. Ushiku","doi":"10.1109/ISSM.2001.962957","DOIUrl":null,"url":null,"abstract":"We performed automatic detection of lithography-related faults by characteristic factors calculated from Fail Bit Count (FBC) data. The frequency of lithography-related faults was monitored as time series data and their origin was specified by correlating machine data. We could classify lithography-related faults and evaluate their yield impact from their frequency and yield loss automatically.","PeriodicalId":356225,"journal":{"name":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Highly sensitive inspection system for lithography-related faults in agile-fab detecting algorithm, monitoring and evaluation of yield impact\",\"authors\":\"H. Matsushita, K. Mitsutake, Y. Arakawa, T. Ishibumi, Y. Ushiku\",\"doi\":\"10.1109/ISSM.2001.962957\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We performed automatic detection of lithography-related faults by characteristic factors calculated from Fail Bit Count (FBC) data. The frequency of lithography-related faults was monitored as time series data and their origin was specified by correlating machine data. We could classify lithography-related faults and evaluate their yield impact from their frequency and yield loss automatically.\",\"PeriodicalId\":356225,\"journal\":{\"name\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2001.962957\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2001.962957","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Highly sensitive inspection system for lithography-related faults in agile-fab detecting algorithm, monitoring and evaluation of yield impact
We performed automatic detection of lithography-related faults by characteristic factors calculated from Fail Bit Count (FBC) data. The frequency of lithography-related faults was monitored as time series data and their origin was specified by correlating machine data. We could classify lithography-related faults and evaluate their yield impact from their frequency and yield loss automatically.
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