利用通道离子注入的自对准反良好掺杂技术及其在0.25 /spl μ m CMOS工艺中的应用

H. Nakamura, T. Horiuchi
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引用次数: 0

摘要

提出了一种利用离子注入通道效应的自对准反掺杂新技术。实现了50%-70%的结电容降低。此外,在0.9 V工作下,0.25 /spl mu/m CMOS逆变器链的模拟传播延迟时间提高了18.3%。
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A self-aligned counter well-doping technology utilizing channeling ion implantation and its application to 0.25 /spl mu/m CMOS process
A new self-aligned counter doping technology intentionally utilizing the channeling effect of ion implantation is presented. A 50%-70% reduction of junction capacitance is achieved. Further, a 18.3% improvement in simulated propagation delay time is demonstrated for a 0.25 /spl mu/m CMOS inverter chain under 0.9 V operation.
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