{"title":"用于网格阵列和MCM基板连接的区域粘合导电环氧胶粘剂预制体","authors":"J.C. Bolger, K. Gilleo","doi":"10.1109/MCMC.1994.292523","DOIUrl":null,"url":null,"abstract":"A new type of z-axis epoxy tape adhesive, called an area bond conductive (ABC) adhesive, has been developed under ARPA contract to replace tin-lead solder for surface mounting grid array components. The ABC adhesive tapes contain discrete regions, or \"dots\", on pitch down to 0.2 mm, of an electrically conductive epoxy within a high strength, high T/sub g/, epoxy dielectric phase. The adhesives are supplied as die cut preforms, which match the size and bond pad pattern of the component to be attached. The preforms cure at 160-175/spl deg/C and require no pressure during cure, to yield a shock resistant, void-free area bond to any FR4 or other board surface. This paper presents bond strength, conductivity, dielectric strength, humidity and thermal shock results for daisy chain test circuits and other components attached to FR4 boards.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Area bonding conductive epoxy adhesive preforms for grid array and MCM substrate attach\",\"authors\":\"J.C. Bolger, K. Gilleo\",\"doi\":\"10.1109/MCMC.1994.292523\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new type of z-axis epoxy tape adhesive, called an area bond conductive (ABC) adhesive, has been developed under ARPA contract to replace tin-lead solder for surface mounting grid array components. The ABC adhesive tapes contain discrete regions, or \\\"dots\\\", on pitch down to 0.2 mm, of an electrically conductive epoxy within a high strength, high T/sub g/, epoxy dielectric phase. The adhesives are supplied as die cut preforms, which match the size and bond pad pattern of the component to be attached. The preforms cure at 160-175/spl deg/C and require no pressure during cure, to yield a shock resistant, void-free area bond to any FR4 or other board surface. This paper presents bond strength, conductivity, dielectric strength, humidity and thermal shock results for daisy chain test circuits and other components attached to FR4 boards.<<ETX>>\",\"PeriodicalId\":292463,\"journal\":{\"name\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1994.292523\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292523","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Area bonding conductive epoxy adhesive preforms for grid array and MCM substrate attach
A new type of z-axis epoxy tape adhesive, called an area bond conductive (ABC) adhesive, has been developed under ARPA contract to replace tin-lead solder for surface mounting grid array components. The ABC adhesive tapes contain discrete regions, or "dots", on pitch down to 0.2 mm, of an electrically conductive epoxy within a high strength, high T/sub g/, epoxy dielectric phase. The adhesives are supplied as die cut preforms, which match the size and bond pad pattern of the component to be attached. The preforms cure at 160-175/spl deg/C and require no pressure during cure, to yield a shock resistant, void-free area bond to any FR4 or other board surface. This paper presents bond strength, conductivity, dielectric strength, humidity and thermal shock results for daisy chain test circuits and other components attached to FR4 boards.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
