Y. Ousten, S. Mejdi, A. Fenech, J. Delétage, L. Béchou, M. Perichaud, Y. Danto
{"title":"使用阻抗谱，扫描电镜和SAM成像早期检测SMT组件的故障","authors":"Y. Ousten, S. Mejdi, A. Fenech, J. Delétage, L. Béchou, M. Perichaud, Y. Danto","doi":"10.1109/IPFA.1997.638124","DOIUrl":null,"url":null,"abstract":"We propose complementary solutions to improve the evaluation of PCB under specific stresses using electrical and physical indicators adapted to a given part of the board. For ceramic capacitors, the residual piezoelectricity provides an impedance signature at resonance allowing detection of local physical defects. Solder joint fatigue criticity under thermal cycle can be predicted using combined analytical and FEM simulations, while the lead phases coarsening provides a good early degradation indicator. At last, ball inspection of BGA packages using shear waves in scanning acoustic microscope lead to an interesting improvement of resolution.","PeriodicalId":159177,"journal":{"name":"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies\",\"authors\":\"Y. Ousten, S. Mejdi, A. Fenech, J. Delétage, L. Béchou, M. Perichaud, Y. Danto\",\"doi\":\"10.1109/IPFA.1997.638124\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose complementary solutions to improve the evaluation of PCB under specific stresses using electrical and physical indicators adapted to a given part of the board. For ceramic capacitors, the residual piezoelectricity provides an impedance signature at resonance allowing detection of local physical defects. Solder joint fatigue criticity under thermal cycle can be predicted using combined analytical and FEM simulations, while the lead phases coarsening provides a good early degradation indicator. At last, ball inspection of BGA packages using shear waves in scanning acoustic microscope lead to an interesting improvement of resolution.\",\"PeriodicalId\":159177,\"journal\":{\"name\":\"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-07-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.1997.638124\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.1997.638124","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies
We propose complementary solutions to improve the evaluation of PCB under specific stresses using electrical and physical indicators adapted to a given part of the board. For ceramic capacitors, the residual piezoelectricity provides an impedance signature at resonance allowing detection of local physical defects. Solder joint fatigue criticity under thermal cycle can be predicted using combined analytical and FEM simulations, while the lead phases coarsening provides a good early degradation indicator. At last, ball inspection of BGA packages using shear waves in scanning acoustic microscope lead to an interesting improvement of resolution.
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