{"title":"从测量或计算的微带元件和不连续点的s参数中提取spice型等效电路的新技术","authors":"P. Werner, Raj Mittra","doi":"10.1109/EPEP.1997.634041","DOIUrl":null,"url":null,"abstract":"This paper introduces a new technique based on the application of the Genetic Algorithm (GA) for extracting the equivalent circuits for measured or computed S-parameters that can be inserted into SPICE simulations. The GA is a robust optimization tool that is shown to yield excellent result for the sample test case of a right angle bend in a microstrip line.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A new technique for the extraction of SPICE-type equivalent circuits from measured or computed S-parameters of microstrip components and discontinuities\",\"authors\":\"P. Werner, Raj Mittra\",\"doi\":\"10.1109/EPEP.1997.634041\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces a new technique based on the application of the Genetic Algorithm (GA) for extracting the equivalent circuits for measured or computed S-parameters that can be inserted into SPICE simulations. The GA is a robust optimization tool that is shown to yield excellent result for the sample test case of a right angle bend in a microstrip line.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634041\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634041","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new technique for the extraction of SPICE-type equivalent circuits from measured or computed S-parameters of microstrip components and discontinuities
This paper introduces a new technique based on the application of the Genetic Algorithm (GA) for extracting the equivalent circuits for measured or computed S-parameters that can be inserted into SPICE simulations. The GA is a robust optimization tool that is shown to yield excellent result for the sample test case of a right angle bend in a microstrip line.