T. Matsuda, Haruka Demachi, H. Iwata, T. Hatakeyama, T. Ohzone
{"title":"一种用于分析金属线对堆叠集成电路温度分布影响的测试结构","authors":"T. Matsuda, Haruka Demachi, H. Iwata, T. Hatakeyama, T. Ohzone","doi":"10.1109/ICMTS.2016.7476167","DOIUrl":null,"url":null,"abstract":"A test structure for analysis of temperature distributions and effects of metal wires on thermal properties in stacked IC is presented. The effects on the temperature distributions and transient phenomena in the single die and the stacked ICs were analyzed. The heat transfer in the metal wires affects the temperature distributions, which are consistent with the thermal simulation results. The test structure can provide an effective way for analysis of thermal properties in various LSIs.","PeriodicalId":344487,"journal":{"name":"2016 International Conference on Microelectronic Test Structures (ICMTS)","volume":"135 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A test structure for analysis of metal wire effect on temperature distribution in stacked IC\",\"authors\":\"T. Matsuda, Haruka Demachi, H. Iwata, T. Hatakeyama, T. Ohzone\",\"doi\":\"10.1109/ICMTS.2016.7476167\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A test structure for analysis of temperature distributions and effects of metal wires on thermal properties in stacked IC is presented. The effects on the temperature distributions and transient phenomena in the single die and the stacked ICs were analyzed. The heat transfer in the metal wires affects the temperature distributions, which are consistent with the thermal simulation results. The test structure can provide an effective way for analysis of thermal properties in various LSIs.\",\"PeriodicalId\":344487,\"journal\":{\"name\":\"2016 International Conference on Microelectronic Test Structures (ICMTS)\",\"volume\":\"135 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 International Conference on Microelectronic Test Structures (ICMTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.2016.7476167\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Microelectronic Test Structures (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2016.7476167","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A test structure for analysis of metal wire effect on temperature distribution in stacked IC
A test structure for analysis of temperature distributions and effects of metal wires on thermal properties in stacked IC is presented. The effects on the temperature distributions and transient phenomena in the single die and the stacked ICs were analyzed. The heat transfer in the metal wires affects the temperature distributions, which are consistent with the thermal simulation results. The test structure can provide an effective way for analysis of thermal properties in various LSIs.
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