{"title":"纳米复合材料的低温低压键合","authors":"Ting-Jui Wu, Jen-Hsiang Liu, Jenn-Ming Song","doi":"10.23919/LTB-3D.2017.7947429","DOIUrl":null,"url":null,"abstract":"It has been proposed that Cu-Ag alloys exhibit longer eletromigration life time than Cu as well as superior electrochemical migration resistance than Ag. Our group developed a new kind of Cu-Ag composite paste which is capable of achieving bonding at low processing temperatures under low bonding pressure. It comprises carboxylate-coated Ag nanoparticles, spary-pyrolyz ed Ag submicron particles and copper formate, which can be applied to interconnection and bonding as well. After being bonded at 160°C under loading of 1.6 MPa for 30 min, the joints with Cu substrates possess bonding strength of 15.9MPa and those with Ag surface finish showing shear strength of 19.4 MPa. The electrical resistivity of the sintered structure thus obtained is 50.8 μΩ-cm.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Low-temperature low-pressure bonding by nanocomposites\",\"authors\":\"Ting-Jui Wu, Jen-Hsiang Liu, Jenn-Ming Song\",\"doi\":\"10.23919/LTB-3D.2017.7947429\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It has been proposed that Cu-Ag alloys exhibit longer eletromigration life time than Cu as well as superior electrochemical migration resistance than Ag. Our group developed a new kind of Cu-Ag composite paste which is capable of achieving bonding at low processing temperatures under low bonding pressure. It comprises carboxylate-coated Ag nanoparticles, spary-pyrolyz ed Ag submicron particles and copper formate, which can be applied to interconnection and bonding as well. After being bonded at 160°C under loading of 1.6 MPa for 30 min, the joints with Cu substrates possess bonding strength of 15.9MPa and those with Ag surface finish showing shear strength of 19.4 MPa. The electrical resistivity of the sintered structure thus obtained is 50.8 μΩ-cm.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947429\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947429","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low-temperature low-pressure bonding by nanocomposites
It has been proposed that Cu-Ag alloys exhibit longer eletromigration life time than Cu as well as superior electrochemical migration resistance than Ag. Our group developed a new kind of Cu-Ag composite paste which is capable of achieving bonding at low processing temperatures under low bonding pressure. It comprises carboxylate-coated Ag nanoparticles, spary-pyrolyz ed Ag submicron particles and copper formate, which can be applied to interconnection and bonding as well. After being bonded at 160°C under loading of 1.6 MPa for 30 min, the joints with Cu substrates possess bonding strength of 15.9MPa and those with Ag surface finish showing shear strength of 19.4 MPa. The electrical resistivity of the sintered structure thus obtained is 50.8 μΩ-cm.
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