C. K. Foong, Wong Shaw Fong, Leong Jenn Seong, H. Yi, L. C. Kan, Kim Kay
{"title":"模制矩阵阵列封装焊料桥接失效的研究","authors":"C. K. Foong, Wong Shaw Fong, Leong Jenn Seong, H. Yi, L. C. Kan, Kim Kay","doi":"10.1109/IEMT.2012.6521761","DOIUrl":null,"url":null,"abstract":"Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigation of solder bridging failure for molded matrix array package\",\"authors\":\"C. K. Foong, Wong Shaw Fong, Leong Jenn Seong, H. Yi, L. C. Kan, Kim Kay\",\"doi\":\"10.1109/IEMT.2012.6521761\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.\",\"PeriodicalId\":315408,\"journal\":{\"name\":\"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2012.6521761\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2012.6521761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigation of solder bridging failure for molded matrix array package
Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.
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