Aurelien Lecavelier des Etangs-Levallois, A. Grivon, D. Baudet, W. Maia, M. Brizoux
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Reliability analysis of electronic assemblies using electrically conductive adhesive for high-reliability and Harsh environment applications
An alternative to lead-free soldering may be Electrically Conductive Adhesives (ECA) that feature lower soldering temperature. However, long-term electrical properties stability and reliability in harsh environment shall be studied. The work presented here is a comprehensive study of ECA second level interconnects characterization under thermal and thermo-mechanical stress for different PCB and component finishing.
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