用于低和负肖特基势垒的硒钝化Si(100)表面

M. Tao, D. Udeshi, S. Agarwal, R. Kolappan, Y. Xu, E. Maldonado, W. Kirk
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引用次数: 2

摘要

理想情况下,金属/Si界面上的肖特基势垒高度由金属功函数和Si电子对n型Si的亲和力之间的差异决定。在现实中,金属和硅之间的界面态固定在界面费米能级上,使得势垒高度或多或少与理想势垒高度无关。我们证明,通过用单层Se终止n型Si(100)上的悬空键,金属和Si之间的界面状态显着降低。因此,对于具有低理想势垒高度的金属,如Al和Cr,可以获得低肖特基势垒。在半导体工业中常用的金属Si和Ti之间证明了负肖特基势垒。负肖特基势垒的热稳定性高达400/spl°C。对于具有较高理想势垒高度的金属,即使采用硒钝化,理想势垒高度与测量势垒高度也不一致。
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Se-passivated Si(100) surface for low and negative Schottky barriers
The Schottky barrier height at a metal/Si interface is ideally determined by the difference between metal work function and Si electron affinity for n-type Si. In reality, interface states between metal and Si pin the interface Fermi level, making the barrier height more or less independent of the ideal barrier height. We demonstrate that, by terminating dangling bonds on n-type Si(100) with a monolayer of Se, interface states are significantly reduced between metal and Si. As a result, low Schottky barriers are obtained for metals with low ideal barrier heights, such as Al and Cr. A negative Schottky barrier is demonstrated between Si and Ti, a metal commonly-used in the semiconductor industry. The negative Schottky barrier is thermally stable up to 400/spl deg/C. For metals with high ideal barrier heights, inconsistency is observed between ideal barrier height and measured barrier height even with Se passivation.
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