K. Murata, T. Saida, I. Ogawa, R. Kasahara, Y. Muramoto, H. Fukuyama, K. Sano, H. Nosaka, H. Kawakami
{"title":"用于光通信的100gbit /s PDM-QPSK集成相干接收前端","authors":"K. Murata, T. Saida, I. Ogawa, R. Kasahara, Y. Muramoto, H. Fukuyama, K. Sano, H. Nosaka, H. Kawakami","doi":"10.1109/CSICS.2011.6062453","DOIUrl":null,"url":null,"abstract":"This paper describes device and integration technologies for 100-Gbit/s polarization division multiplexed quadrature phase shift keying integrated coherent receiver front-end. The silica-based planar lightwave circuits for the optical passive circuits, InP-based photodiode for the opto-electrical conversion, and InP HBT for the transimpedance amplification are used to achieve high-performance. A module-level hybrid integration technology based on a chip-scale packaged O/E converter is applied as the integration technology. The fabricated receiver front-end has a wide dynamic range of around 20dB with a constant local power of 13.5 dBm and an excellent common-mode rejection ratio of better than -25dB up to 25GHz.","PeriodicalId":275064,"journal":{"name":"2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"100-Gbit/s PDM-QPSK Integrated Coherent Receiver Front-End for Optical Communications\",\"authors\":\"K. Murata, T. Saida, I. Ogawa, R. Kasahara, Y. Muramoto, H. Fukuyama, K. Sano, H. Nosaka, H. Kawakami\",\"doi\":\"10.1109/CSICS.2011.6062453\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes device and integration technologies for 100-Gbit/s polarization division multiplexed quadrature phase shift keying integrated coherent receiver front-end. The silica-based planar lightwave circuits for the optical passive circuits, InP-based photodiode for the opto-electrical conversion, and InP HBT for the transimpedance amplification are used to achieve high-performance. A module-level hybrid integration technology based on a chip-scale packaged O/E converter is applied as the integration technology. The fabricated receiver front-end has a wide dynamic range of around 20dB with a constant local power of 13.5 dBm and an excellent common-mode rejection ratio of better than -25dB up to 25GHz.\",\"PeriodicalId\":275064,\"journal\":{\"name\":\"2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSICS.2011.6062453\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2011.6062453","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
100-Gbit/s PDM-QPSK Integrated Coherent Receiver Front-End for Optical Communications
This paper describes device and integration technologies for 100-Gbit/s polarization division multiplexed quadrature phase shift keying integrated coherent receiver front-end. The silica-based planar lightwave circuits for the optical passive circuits, InP-based photodiode for the opto-electrical conversion, and InP HBT for the transimpedance amplification are used to achieve high-performance. A module-level hybrid integration technology based on a chip-scale packaged O/E converter is applied as the integration technology. The fabricated receiver front-end has a wide dynamic range of around 20dB with a constant local power of 13.5 dBm and an excellent common-mode rejection ratio of better than -25dB up to 25GHz.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
