{"title":"最新高密度有机层压板上HBM2E模块的信号完整性设计与链路预算结果分析","authors":"F. Libsch, H. Mori, X. Gu","doi":"10.1109/ectc51906.2022.00338","DOIUrl":null,"url":null,"abstract":"The focus of this work encompasses signal integrity (SI) design and analysis in hybrid integration of the latest generation of High Bandwidth Memory (HBM2E) onto the latest generation high density Organic Package now capable of 1.5um line and space interconnects. In this paper, for the first time, we design and analyze the whole system HBM2E link budget components on latest generation high density Organic Package where the methodology details all the interconnect signal uncertainties.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate\",\"authors\":\"F. Libsch, H. Mori, X. Gu\",\"doi\":\"10.1109/ectc51906.2022.00338\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The focus of this work encompasses signal integrity (SI) design and analysis in hybrid integration of the latest generation of High Bandwidth Memory (HBM2E) onto the latest generation high density Organic Package now capable of 1.5um line and space interconnects. In this paper, for the first time, we design and analyze the whole system HBM2E link budget components on latest generation high density Organic Package where the methodology details all the interconnect signal uncertainties.\",\"PeriodicalId\":139520,\"journal\":{\"name\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ectc51906.2022.00338\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00338","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
The focus of this work encompasses signal integrity (SI) design and analysis in hybrid integration of the latest generation of High Bandwidth Memory (HBM2E) onto the latest generation high density Organic Package now capable of 1.5um line and space interconnects. In this paper, for the first time, we design and analyze the whole system HBM2E link budget components on latest generation high density Organic Package where the methodology details all the interconnect signal uncertainties.
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