{"title":"基于表面活化键合的光学多芯片三维集成高密度微系统封装","authors":"E. Higurashi, D. Chino, T. Suga, R. Sawada","doi":"10.1109/OMEMS.2008.4607829","DOIUrl":null,"url":null,"abstract":"The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150degC). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm times 2.6 mm times 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.","PeriodicalId":402931,"journal":{"name":"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2008-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging\",\"authors\":\"E. Higurashi, D. Chino, T. Suga, R. Sawada\",\"doi\":\"10.1109/OMEMS.2008.4607829\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150degC). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm times 2.6 mm times 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.\",\"PeriodicalId\":402931,\"journal\":{\"name\":\"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-08-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/OMEMS.2008.4607829\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OMEMS.2008.4607829","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
多芯片的三维混合集成是实现高功能、紧凑的光电微系统的重要技术。本研究利用Au-Au表面活化键合(键合温度150℃)成功实现了光学芯片的三维集成。所制备的微系统由两个元素组成:i)一个微加工硅光学平台,包含一个键合激光二极管、微镜和通孔电极;以及ii)包含键合光电二极管、电互连和折射微透镜的玻璃基板。采用表面活化键合的方法将硅光学平台与玻璃基板垂直堆叠。完全集成微系统的尺寸仅为2.6 mm × 2.6 mm × 1mm厚。设计和制造过程允许芯片级和晶圆级封装。此外,还讨论了激光多普勒测速传感器的应用。
Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging
The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150degC). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm times 2.6 mm times 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.