{"title":"双mos:双mos栅极的基本单元","authors":"A. El Gamal, J. Kouloheris, D. How, M. Morf","doi":"10.1109/CICC.1989.56710","DOIUrl":null,"url":null,"abstract":"A BiNMOS test chip has been designed and fabricated in 0.8-μm BiCMOS technology. The test chip consists of a 4×22 array of BiNMOS cells. The test structures include a ring oscillator, a 4-bit SRAM (static random-access memory) core, five types of buffers, a MUX, and a shift register. Ring oscillator measurements indicate a basic BiNMOS inverter delay of 240 ps (FO=1), a result that agrees well with simulation","PeriodicalId":165054,"journal":{"name":"1989 Proceedings of the IEEE Custom Integrated Circuits Conference","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"54","resultStr":"{\"title\":\"BiNMOS: a basic cell for BiCMOS sea-of-gates\",\"authors\":\"A. El Gamal, J. Kouloheris, D. How, M. Morf\",\"doi\":\"10.1109/CICC.1989.56710\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A BiNMOS test chip has been designed and fabricated in 0.8-μm BiCMOS technology. The test chip consists of a 4×22 array of BiNMOS cells. The test structures include a ring oscillator, a 4-bit SRAM (static random-access memory) core, five types of buffers, a MUX, and a shift register. Ring oscillator measurements indicate a basic BiNMOS inverter delay of 240 ps (FO=1), a result that agrees well with simulation\",\"PeriodicalId\":165054,\"journal\":{\"name\":\"1989 Proceedings of the IEEE Custom Integrated Circuits Conference\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"54\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1989 Proceedings of the IEEE Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.1989.56710\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1989 Proceedings of the IEEE Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1989.56710","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A BiNMOS test chip has been designed and fabricated in 0.8-μm BiCMOS technology. The test chip consists of a 4×22 array of BiNMOS cells. The test structures include a ring oscillator, a 4-bit SRAM (static random-access memory) core, five types of buffers, a MUX, and a shift register. Ring oscillator measurements indicate a basic BiNMOS inverter delay of 240 ps (FO=1), a result that agrees well with simulation