{"title":"用于空间应用的PCB内嵌入式功率GaN组件","authors":"T. Youssef, T. Löher, S. Azzopardi","doi":"10.23919/ICEP55381.2022.9795593","DOIUrl":null,"url":null,"abstract":"This paper presents the embedding of prepackaged GaN-components for an application of power propulsion unit (PPU) for satellite applications. First embedding trials of the packages with only minor preconditioning resulted in massive failure of the modules in reflow-tests. These failures have been analyzed and understood thanks to finite elements simulations.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Embedded Power GaN Components inside a PCB for space applications\",\"authors\":\"T. Youssef, T. Löher, S. Azzopardi\",\"doi\":\"10.23919/ICEP55381.2022.9795593\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the embedding of prepackaged GaN-components for an application of power propulsion unit (PPU) for satellite applications. First embedding trials of the packages with only minor preconditioning resulted in massive failure of the modules in reflow-tests. These failures have been analyzed and understood thanks to finite elements simulations.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795593\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795593","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Embedded Power GaN Components inside a PCB for space applications
This paper presents the embedding of prepackaged GaN-components for an application of power propulsion unit (PPU) for satellite applications. First embedding trials of the packages with only minor preconditioning resulted in massive failure of the modules in reflow-tests. These failures have been analyzed and understood thanks to finite elements simulations.
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