{"title":"用于高密度互联应用的先进环保材料","authors":"K. Hanamura, N. Honda, T. Suzuki, M. Aoki","doi":"10.1109/ADHES.2000.860624","DOIUrl":null,"url":null,"abstract":"In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardants are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, and we have developed halogen-free FR-4 and resin coated copper foil. Meanwhile, a tendency is also seen to regulate lead within solder, causing progress in the development of lead-free solder. In this paper, we describe the effects of halogen-free materials on the lead-free solder process.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Advanced environmental friendly materials for HDI applications\",\"authors\":\"K. Hanamura, N. Honda, T. Suzuki, M. Aoki\",\"doi\":\"10.1109/ADHES.2000.860624\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardants are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, and we have developed halogen-free FR-4 and resin coated copper foil. Meanwhile, a tendency is also seen to regulate lead within solder, causing progress in the development of lead-free solder. In this paper, we describe the effects of halogen-free materials on the lead-free solder process.\",\"PeriodicalId\":222663,\"journal\":{\"name\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"volume\":\"77 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ADHES.2000.860624\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860624","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advanced environmental friendly materials for HDI applications
In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardants are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, and we have developed halogen-free FR-4 and resin coated copper foil. Meanwhile, a tendency is also seen to regulate lead within solder, causing progress in the development of lead-free solder. In this paper, we describe the effects of halogen-free materials on the lead-free solder process.