工业0.5 /spl μ m CMOS技术的统计特性和设计技术的实现

S. Healy, E. Horan, K. McCarthy, A. Mathewson, Z. Ning, E. Rombouts, W. Vanderbauwhede, M. Tack
{"title":"工业0.5 /spl μ m CMOS技术的统计特性和设计技术的实现","authors":"S. Healy, E. Horan, K. McCarthy, A. Mathewson, Z. Ning, E. Rombouts, W. Vanderbauwhede, M. Tack","doi":"10.1109/ICMTS.1999.766249","DOIUrl":null,"url":null,"abstract":"This paper presents a methodology for statistical worst-case simulation using the BSIM3v3 model within commercially available tools. Statistical techniques such as principal component analysis and Box-Behnken designs are used to generate a subset of models which reflect the variation of measured device performance. These worst-case corners can be used in circuit simulation to account for the effects of statistical fluctuation on circuit performance. An indication of key process parameters that need to be monitored and controlled is also provided.","PeriodicalId":273071,"journal":{"name":"ICMTS 1999. Proceedings of 1999 International Conference on Microelectronic Test Structures (Cat. No.99CH36307)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Implementation of statistical characterisation and design techniques for an industrial 0.5 /spl mu/m CMOS technology\",\"authors\":\"S. Healy, E. Horan, K. McCarthy, A. Mathewson, Z. Ning, E. Rombouts, W. Vanderbauwhede, M. Tack\",\"doi\":\"10.1109/ICMTS.1999.766249\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a methodology for statistical worst-case simulation using the BSIM3v3 model within commercially available tools. Statistical techniques such as principal component analysis and Box-Behnken designs are used to generate a subset of models which reflect the variation of measured device performance. These worst-case corners can be used in circuit simulation to account for the effects of statistical fluctuation on circuit performance. An indication of key process parameters that need to be monitored and controlled is also provided.\",\"PeriodicalId\":273071,\"journal\":{\"name\":\"ICMTS 1999. Proceedings of 1999 International Conference on Microelectronic Test Structures (Cat. No.99CH36307)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 1999. Proceedings of 1999 International Conference on Microelectronic Test Structures (Cat. No.99CH36307)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1999.766249\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 1999. Proceedings of 1999 International Conference on Microelectronic Test Structures (Cat. No.99CH36307)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1999.766249","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文介绍了一种使用商业可用工具中的BSIM3v3模型进行统计最坏情况模拟的方法。主成分分析和Box-Behnken设计等统计技术用于生成反映测量设备性能变化的模型子集。这些最坏情况角可以用于电路仿真,以解释统计波动对电路性能的影响。还提供了需要监视和控制的关键工艺参数的指示。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Implementation of statistical characterisation and design techniques for an industrial 0.5 /spl mu/m CMOS technology
This paper presents a methodology for statistical worst-case simulation using the BSIM3v3 model within commercially available tools. Statistical techniques such as principal component analysis and Box-Behnken designs are used to generate a subset of models which reflect the variation of measured device performance. These worst-case corners can be used in circuit simulation to account for the effects of statistical fluctuation on circuit performance. An indication of key process parameters that need to be monitored and controlled is also provided.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A compact SOI model for fully-depleted and partially-depleted 0.25 /spl mu/m SIMOX devices Inclusion of substrate effects in the flyback method for BJT resistance characterisation Sheet and line resistance of patterned SOI surface film CD reference materials as a function of substrate bias Analysis of current flow in mono-crystalline electrical linewidth structures A new test structure for direct extraction of SPICE model parameters for double polysilicon bipolar transistors
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1