一种新的三维时域有限差分(3D-FDTD)模拟器,用于模拟电子互连和封装

L.X. Lu, C. Wu, J. Litva
{"title":"一种新的三维时域有限差分(3D-FDTD)模拟器,用于模拟电子互连和封装","authors":"L.X. Lu, C. Wu, J. Litva","doi":"10.1109/EPEP.1993.394582","DOIUrl":null,"url":null,"abstract":"It has been shown that the finite difference time domain (FDTD) method is an accurate and flexible technique to simulate complex electromagnetic problems. A 3D-FDTD software package is introduced. It can be used to simulate electronic packaging problems from an electromagnetic field point of view.<<ETX>>","PeriodicalId":338671,"journal":{"name":"Proceedings of IEEE Electrical Performance of Electronic Packaging","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A new three dimensional finite difference time domain (3D-FDTD) simulator for modelling electronic interconnections and packaging\",\"authors\":\"L.X. Lu, C. Wu, J. Litva\",\"doi\":\"10.1109/EPEP.1993.394582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It has been shown that the finite difference time domain (FDTD) method is an accurate and flexible technique to simulate complex electromagnetic problems. A 3D-FDTD software package is introduced. It can be used to simulate electronic packaging problems from an electromagnetic field point of view.<<ETX>>\",\"PeriodicalId\":338671,\"journal\":{\"name\":\"Proceedings of IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1993.394582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1993.394582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

结果表明,时域有限差分法是一种精确、灵活的模拟复杂电磁问题的方法。介绍了一种三维时域有限差分软件包。它可以从电磁场的角度来模拟电子封装问题
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A new three dimensional finite difference time domain (3D-FDTD) simulator for modelling electronic interconnections and packaging
It has been shown that the finite difference time domain (FDTD) method is an accurate and flexible technique to simulate complex electromagnetic problems. A 3D-FDTD software package is introduced. It can be used to simulate electronic packaging problems from an electromagnetic field point of view.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
An integral equation approach to the prediction of the capacitance and the inductance of a via through-hole EM analysis of low inductance decoupling capacitors Measurement and prediction of near field shielding properties of perforated flat screens A signal integrity advisor for automated packaging design Performance comparison of single- and multiple-chip packages in a personal computer application
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1