{"title":"一种新的三维时域有限差分(3D-FDTD)模拟器,用于模拟电子互连和封装","authors":"L.X. Lu, C. Wu, J. Litva","doi":"10.1109/EPEP.1993.394582","DOIUrl":null,"url":null,"abstract":"It has been shown that the finite difference time domain (FDTD) method is an accurate and flexible technique to simulate complex electromagnetic problems. A 3D-FDTD software package is introduced. It can be used to simulate electronic packaging problems from an electromagnetic field point of view.<<ETX>>","PeriodicalId":338671,"journal":{"name":"Proceedings of IEEE Electrical Performance of Electronic Packaging","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A new three dimensional finite difference time domain (3D-FDTD) simulator for modelling electronic interconnections and packaging\",\"authors\":\"L.X. Lu, C. Wu, J. Litva\",\"doi\":\"10.1109/EPEP.1993.394582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It has been shown that the finite difference time domain (FDTD) method is an accurate and flexible technique to simulate complex electromagnetic problems. A 3D-FDTD software package is introduced. It can be used to simulate electronic packaging problems from an electromagnetic field point of view.<<ETX>>\",\"PeriodicalId\":338671,\"journal\":{\"name\":\"Proceedings of IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1993.394582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1993.394582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new three dimensional finite difference time domain (3D-FDTD) simulator for modelling electronic interconnections and packaging
It has been shown that the finite difference time domain (FDTD) method is an accurate and flexible technique to simulate complex electromagnetic problems. A 3D-FDTD software package is introduced. It can be used to simulate electronic packaging problems from an electromagnetic field point of view.<>