含纤维素纳米纤维镀锡的研究进展

T. Kobayashi, A. Kogure, I. Shohji
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引用次数: 0

摘要

我们重点研究了低成本、高强度的纤维素纳米纤维(CNFs),以替代银作为无铅焊料材料。在本研究中,通过硫化物还原处理使CNF具有导电性,在Cu板上形成Sn/导电CNF复合镀层。电镀后,将镀有Sn/导电CNF复合镀层的两块Cu板加热连接,观察焊点的微观组织。研究发现,导电CNFs被掺入到镀锡膜中,而加入后,导电CNFs由于Sn的熔化而团聚。
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Development of Sn Solder Plating Containing Cellulose Nanofiber
We focused on low-cost and high-strength cellulose nanofibers (CNFs) as a substitute for Ag used for lead- free solder material. In this study, Sn/conductive CNF composite plating film was formed on a Cu plate after the CNFs were given electrical conductivity by sulfide reduction treatment. After plating, two Cu plates with the Sn/conductive CNF composite plating film were heated and joined to investigate the microstructure of the solder joint. It was found that conductive CNFs were incorporated into Sn plating films, while after joining, the conductive CNFs were agglomerated due to the melting of Sn.
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