n-InP光化学蚀刻:温度、功率和频率的研究

T. Lowes, D. Cassidy
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引用次数: 1

摘要

用Ar/sup +/激光和稀磷酸溶液研究了温度、功率、光照频率和占空比对n-InP光化学蚀刻的影响。反应速率受限,活化能>或=0.34 eV。光蚀刻速率,即蚀刻速率除以Ar/sup +/灯打开的时间分数,被发现是照明占空比的函数,而不是100-3200 Hz范围内斩波频率的函数。这些结果是在材料去除速率方程模型的基础上解释的。本文介绍了在PC刻蚀中制备35 ~ 200 μ m厚的n-InP晶片,并在透射电镜下进行观察。
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Photochemical etching of n-InP: temperature, power and frequency studies
Photochemical (PC) etching of n-InP using an Ar/sup +/ laser and dilute phosphoric acid solutions was studied as a function of temperature, power, illumination frequency, and duty cycle. The process was found to be reaction-rate limited with an activation energy >or=0.34 eV. The photo-etch rate, i.e. the etch rate divided by the fraction of time the Ar/sup +/ light is on, was found to be a function of the illumination duty cycle but not the chopping frequency in the range 100-3200 Hz. These results are explained on the basis of a rate equation model for material removal. An application for PC etching is presented in which n-InP wafers 35-200- mu m thick were prepared for observation in the transmission electron microscope.<>
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