超薄体和大块氧化cmosfet的器件可变性和可靠性检查

W. Yeh, C. Lai, L. Chin, Po-Ying Chen
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引用次数: 0

摘要

在这项工作中,我们研究了衬底掺杂浓度对超薄体和块氧化物SOI MOSFET器件特性变化和衬底偏置灵敏度的影响。我们发现高底物剂量器件存在器件特性的不对称和变异。与高剂量衬底UTBB-SOI器件相比,低剂量衬底器件特性对衬底背偏不敏感。结果表明,低衬底剂量的SOI器件具有较低的冲击电离度,其可靠性优于高衬底剂量的器件。
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Device variability and reliability check for ultra-thin-body and bulk oxide CMOSFETs
In this work, we investigate the impact of substrate doping concentration on device characteristic variation and sensitivity to substrate bias for ultra-thin body and bulk oxide SOI MOSFET. We found that high substrate dose device suffer from unsymmetrical and variance in device's characteristics. Compared to high dose substrate UTBB-SOI device, low dose substrate device characteristic is less sensitive to substrate back bias. And we found that low substrate dose SOI device which with lower impact ionization shows better device's reliability than the high substrate dose one does.
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