优化备用利用率,提高逻辑内置自修复的可靠性和平均寿命

T. Koal, H. Vierhaus
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引用次数: 15

摘要

可靠性和平均寿命是当今半导体器件制造的主要方面。晶体管尺寸和电源的不断缩小是集成电路对时间零工艺变化、时间相关退化和由粒子撞击等环境影响引起的随机故障的更高脆弱性的根本原因。处理永久性故障不可避免地成为保证高可靠性和延长使用寿命的合适解决方案。内置自我修复是一种可能的解决方案,它以额外的硬件为代价,用备件更换有故障的设备。在本文中,我们评估了不同的更换策略及其产生的额外硬件结构对可靠性和平均寿命的影响。这种分析过程允许找到给定系统的最佳替代策略,而无需实现和综合每个案例。
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Optimal spare utilization for reliability and mean lifetime improvement of logic built-in self-repair
Reliability and the mean lifetime are major aspects in today's semiconductor device manufacturing. The continuous downscaling of transistor sizes and power supplies are the root causes of higher vulnerabilities of integrated circuits against time zero process variation, time dependent degradation and random faults induced by environmental influences like particle strikes. Handling permanent faults becomes inevitably a suitable solution to guarantee high reliabilities as well as increased lifetimes. Built-in self-repair is a possible solution, which exchanges faulty units with spare parts at the costs of extra hardware. In this paper, we evaluate the influence of different replacement strategies and their resulting additional hardware structures on reliability and mean lifetime. This analytical process allows to find the optimal replacement strategy for a given system, without implementing and synthesizing each case.
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