GaNHEMTs供体样表面阱发射的研究

Amirali Chalechale, M. Shalchian, F. Jazaeri
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引用次数: 0

摘要

通过TCAD瞬态模拟研究了位于AIGaN/GaN hemt电极之间通道区域的供体表面陷阱所引起的门滞后诱捕效应。研究了陷阱能级和温度变化对电流坍塌瞬态特性的影响。提出了一个简单的物理模型(基于Arrhenius关系)来计算发射时间常数随阱能级和温度的变化,该模型与TCAD模拟结果吻合较好。
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Study of Donor-like Surface Trap Emission in GaNHEMTs
Gate-lag induced trapping effects due to donor-like surface traps located in the access regions between the electrodes of AIGaN/GaN HEMTs are investigated through TCAD transient simulations. The effects of variation in trap energy level and temperature on the current collapse transient characteristics have been studied. A simple physical model is proposed (based on the Arrhenius relation) to obtain the emission time constants versus trap energy level and temperature which is in a good agreement with TCAD simulations.
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