{"title":"用分析方法研究了贮存时间对镀锡可焊性的影响","authors":"Hui Xu","doi":"10.1109/ICRMS.2016.8050165","DOIUrl":null,"url":null,"abstract":"This paper mainly studied the effect of storage time on solderability of two kinds of Sn plating of flat gull wing leads on plastic package IC component. Design the aging test, and then use Xray photoelectron spectroscopy (XPS), wetting balance test and data analysis, to obtain storage of coating aging degree and the change of the terminal wetting balance. Consequently, provided the criterion for establish the logical storage term of components.","PeriodicalId":347031,"journal":{"name":"2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An analytical method to find the effect of storage time on solderability of Sn plating\",\"authors\":\"Hui Xu\",\"doi\":\"10.1109/ICRMS.2016.8050165\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper mainly studied the effect of storage time on solderability of two kinds of Sn plating of flat gull wing leads on plastic package IC component. Design the aging test, and then use Xray photoelectron spectroscopy (XPS), wetting balance test and data analysis, to obtain storage of coating aging degree and the change of the terminal wetting balance. Consequently, provided the criterion for establish the logical storage term of components.\",\"PeriodicalId\":347031,\"journal\":{\"name\":\"2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICRMS.2016.8050165\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICRMS.2016.8050165","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An analytical method to find the effect of storage time on solderability of Sn plating
This paper mainly studied the effect of storage time on solderability of two kinds of Sn plating of flat gull wing leads on plastic package IC component. Design the aging test, and then use Xray photoelectron spectroscopy (XPS), wetting balance test and data analysis, to obtain storage of coating aging degree and the change of the terminal wetting balance. Consequently, provided the criterion for establish the logical storage term of components.
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