{"title":"FEOL湿法清洁工艺良率提高的实例研究","authors":"R. Mitra, Zhiyong Xie","doi":"10.1109/ASMC.2019.8791786","DOIUrl":null,"url":null,"abstract":"Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Case Study of Yield Improvement in a FEOL Wet Clean Process\",\"authors\":\"R. Mitra, Zhiyong Xie\",\"doi\":\"10.1109/ASMC.2019.8791786\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.\",\"PeriodicalId\":287541,\"journal\":{\"name\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2019.8791786\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791786","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Case Study of Yield Improvement in a FEOL Wet Clean Process
Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.