{"title":"利用氧、氢、氮、氨及其混合物优化远程螺旋ICP等离子体放电天线电压平衡:AEPM:先进设备工艺和材料","authors":"S. J. Yoon, Jongwoo Park, A. Kim","doi":"10.1109/ASMC.2019.8791803","DOIUrl":null,"url":null,"abstract":"Inductively coupled plasma technology is widely used for photoresist strip processes in the modern semiconductor industry. We examined plasma discharge behavior according to various gas mixtures and end capacitance values. Antenna voltage and plasma impedance were measured during plasma discharge. Plasma harmonic was experimentally compared by adjusting the antenna balance. We report the experimental results which reveal that the changes in antenna voltage is associated with the applied gases and their mixing ratio.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimizing antenna voltage balancing for remote helical ICP plasma discharge using Oxygen, Hydrogen, Nitrogen, Ammonia and their mixtures : AEPM: Advanced Equipment Processes and Materials\",\"authors\":\"S. J. Yoon, Jongwoo Park, A. Kim\",\"doi\":\"10.1109/ASMC.2019.8791803\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Inductively coupled plasma technology is widely used for photoresist strip processes in the modern semiconductor industry. We examined plasma discharge behavior according to various gas mixtures and end capacitance values. Antenna voltage and plasma impedance were measured during plasma discharge. Plasma harmonic was experimentally compared by adjusting the antenna balance. We report the experimental results which reveal that the changes in antenna voltage is associated with the applied gases and their mixing ratio.\",\"PeriodicalId\":287541,\"journal\":{\"name\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2019.8791803\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791803","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optimizing antenna voltage balancing for remote helical ICP plasma discharge using Oxygen, Hydrogen, Nitrogen, Ammonia and their mixtures : AEPM: Advanced Equipment Processes and Materials
Inductively coupled plasma technology is widely used for photoresist strip processes in the modern semiconductor industry. We examined plasma discharge behavior according to various gas mixtures and end capacitance values. Antenna voltage and plasma impedance were measured during plasma discharge. Plasma harmonic was experimentally compared by adjusting the antenna balance. We report the experimental results which reveal that the changes in antenna voltage is associated with the applied gases and their mixing ratio.
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