{"title":"带网格接地面的耦合互连中的串扰","authors":"S. Luo, Jyh-Ming Jang, V. Tripathi","doi":"10.1109/MCMC.1994.292514","DOIUrl":null,"url":null,"abstract":"A method for the time domain simulation of coupled interconnects in a layered medium with meshed ground planes is presented. The method, based on the quasi-TEM spectral domain analysis of the layered structure and the SPICE model consisting of delay elements and linear dependent sources, is used to study crosstalk in coupled interconnects. The theoretical results are validated by experimental data, and it is shown that the presence of slots and meshes in ground planes can reduce the far-end crosstalk in coupled interconnects.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Crosstalk in coupled interconnects with meshed ground planes\",\"authors\":\"S. Luo, Jyh-Ming Jang, V. Tripathi\",\"doi\":\"10.1109/MCMC.1994.292514\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method for the time domain simulation of coupled interconnects in a layered medium with meshed ground planes is presented. The method, based on the quasi-TEM spectral domain analysis of the layered structure and the SPICE model consisting of delay elements and linear dependent sources, is used to study crosstalk in coupled interconnects. The theoretical results are validated by experimental data, and it is shown that the presence of slots and meshes in ground planes can reduce the far-end crosstalk in coupled interconnects.<<ETX>>\",\"PeriodicalId\":292463,\"journal\":{\"name\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1994.292514\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292514","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Crosstalk in coupled interconnects with meshed ground planes
A method for the time domain simulation of coupled interconnects in a layered medium with meshed ground planes is presented. The method, based on the quasi-TEM spectral domain analysis of the layered structure and the SPICE model consisting of delay elements and linear dependent sources, is used to study crosstalk in coupled interconnects. The theoretical results are validated by experimental data, and it is shown that the presence of slots and meshes in ground planes can reduce the far-end crosstalk in coupled interconnects.<>
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