HfO2 MOS结构中界面层缺陷与不稳定性

J. Ryan, P. Lenahan
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引用次数: 1

摘要

近年来的研究表明,硅/介电边界附近的深能级缺陷是HfO2基器件的重要可靠性问题。在本研究中,我们对存在于HfO2基器件界面层(IL)中的电活性中心的化学和结构性质进行了部分鉴定。几乎可以肯定,这个缺陷涉及到一个可能与附近的铪原子弱耦合的缺氧硅。
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Interfacial layer defects and instabilities in HfO2 MOS structures
Recent studies have demonstrated that deep level defects very near the Si/dielectric boundary are important reliability problems in HfO2 based devices. In this study, we provide a partial identification of the chemical and structural nature of an electrically active center which is present in the interfacial layer (IL) of HfO2 based devices. The defect almost certainly involves an oxygen deficient silicon probably weakly coupled to a nearby hafnium atom.
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