{"title":"基于聚合物的单片集成电路倒装芯片互连材料","authors":"N. Strifas, A. Christou","doi":"10.1115/imece1996-0897","DOIUrl":null,"url":null,"abstract":"\n The results of simulation, and material performance testing of anisotropic conductive polymers for flip chip interconnects necessary for power MMICs are reported. The flip chip interconnects are designed to connect source metallization to a common ground plane, and also to provide for heat sinking paths to a ceramic substrate. Finite Element Analysis results are also reported simulating the thermal mechanical stresses present during high frequency operation at a frequency of 1–10 GHz.","PeriodicalId":375055,"journal":{"name":"Sensing, Modeling and Simulation in Emerging Electronic Packaging","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits\",\"authors\":\"N. Strifas, A. Christou\",\"doi\":\"10.1115/imece1996-0897\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The results of simulation, and material performance testing of anisotropic conductive polymers for flip chip interconnects necessary for power MMICs are reported. The flip chip interconnects are designed to connect source metallization to a common ground plane, and also to provide for heat sinking paths to a ceramic substrate. Finite Element Analysis results are also reported simulating the thermal mechanical stresses present during high frequency operation at a frequency of 1–10 GHz.\",\"PeriodicalId\":375055,\"journal\":{\"name\":\"Sensing, Modeling and Simulation in Emerging Electronic Packaging\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Sensing, Modeling and Simulation in Emerging Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece1996-0897\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensing, Modeling and Simulation in Emerging Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece1996-0897","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits
The results of simulation, and material performance testing of anisotropic conductive polymers for flip chip interconnects necessary for power MMICs are reported. The flip chip interconnects are designed to connect source metallization to a common ground plane, and also to provide for heat sinking paths to a ceramic substrate. Finite Element Analysis results are also reported simulating the thermal mechanical stresses present during high frequency operation at a frequency of 1–10 GHz.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
