{"title":"60GHz天线阵列，考虑散热，适用于大规模mimo应用","authors":"Xing Li, Bei-Bei Xu, Hong-li Peng","doi":"10.1109/EDAPS.2016.7893131","DOIUrl":null,"url":null,"abstract":"A 60GHz Massive-MIMO patch antenna array, consisting of 8×16 elements, is presented in this paper. To overcome its heat problem caused by active circuits in its system, heatsink (HT) solution around the array are explored, focusing on the impact of the HT on array radiating characteristics. Simulation shows that our proposed array and HT solution is a very promising for 60 GHz Massive-MIMO system applications.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A 60GHz antenna array with heatsink considerations for massive-MIMO applications\",\"authors\":\"Xing Li, Bei-Bei Xu, Hong-li Peng\",\"doi\":\"10.1109/EDAPS.2016.7893131\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 60GHz Massive-MIMO patch antenna array, consisting of 8×16 elements, is presented in this paper. To overcome its heat problem caused by active circuits in its system, heatsink (HT) solution around the array are explored, focusing on the impact of the HT on array radiating characteristics. Simulation shows that our proposed array and HT solution is a very promising for 60 GHz Massive-MIMO system applications.\",\"PeriodicalId\":191549,\"journal\":{\"name\":\"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2016.7893131\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2016.7893131","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 60GHz antenna array with heatsink considerations for massive-MIMO applications
A 60GHz Massive-MIMO patch antenna array, consisting of 8×16 elements, is presented in this paper. To overcome its heat problem caused by active circuits in its system, heatsink (HT) solution around the array are explored, focusing on the impact of the HT on array radiating characteristics. Simulation shows that our proposed array and HT solution is a very promising for 60 GHz Massive-MIMO system applications.
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