{"title":"CMOS技术在模拟电路设计中的优点评估","authors":"M. Vertregt, P. Scholtens","doi":"10.1109/ESSCIR.2004.1356615","DOIUrl":null,"url":null,"abstract":"Key device parameters such as drain current, transconductance, current factor, capacitance, etc. are linked to typical analog circuit level performance criteria, as a function of the CMOS technology node. Subsequently, speed and power implications for an analog-to-digital converter building block are estimated. Significant power efficiency improvements are predicted as a result of scaling to deep sub-micron technology nodes.","PeriodicalId":294077,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference","volume":"80 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Assessment of the merits of CMOS technology scaling for analog circuit design\",\"authors\":\"M. Vertregt, P. Scholtens\",\"doi\":\"10.1109/ESSCIR.2004.1356615\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Key device parameters such as drain current, transconductance, current factor, capacitance, etc. are linked to typical analog circuit level performance criteria, as a function of the CMOS technology node. Subsequently, speed and power implications for an analog-to-digital converter building block are estimated. Significant power efficiency improvements are predicted as a result of scaling to deep sub-micron technology nodes.\",\"PeriodicalId\":294077,\"journal\":{\"name\":\"Proceedings of the 30th European Solid-State Circuits Conference\",\"volume\":\"80 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-11-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 30th European Solid-State Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSCIR.2004.1356615\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 30th European Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIR.2004.1356615","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Assessment of the merits of CMOS technology scaling for analog circuit design
Key device parameters such as drain current, transconductance, current factor, capacitance, etc. are linked to typical analog circuit level performance criteria, as a function of the CMOS technology node. Subsequently, speed and power implications for an analog-to-digital converter building block are estimated. Significant power efficiency improvements are predicted as a result of scaling to deep sub-micron technology nodes.