射频刺激下GaAs mmic寿命测试

W. Roesch, T. Rubalcava, C. Hanson
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引用次数: 18

摘要

作者总结了由摩托罗拉GEG设计、组装和筛选、TriQuint制造和测试的单片微波集成电路(MMIC)开关和衰减器的高温寿命试验结果。研究发现,单个加热和射频偏置导致的数据表明,这些器件按照对数正态失效分布线性退化,并且与MMIC放大器的历史直流寿命测试相比表现良好。电测量表明MESFET栅极正在发生退化,故障分析证实了这一点。研究发现,温度会大大加速失效机制,在正常使用条件下,预计不会影响设备数千年的寿命。
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Lifetesting GaAs MMICs under RF stimulus
The authors summarize very-high-temperature life-test results on monolithic microwave integrated circuit (MMIC) switches and attenuators designed, assembled, and screened by Motorola GEG and manufactured and tested by TriQuint. It was found that individual heating and RF bias resulted in data that indicate that these devices degrade linearly with lognormal failure distributions and compare favorably with historical DC life-testing of MMIC amplifiers. Electrical measurements indicated MESFET gate degradation was occurring, which was confirmed by failure analysis. The failure mechanism was found to be highly accelerated by temperature and is not expected to impede device lifetimes at normal use conditions for thousands of years.<>
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