封装微带电路中膜片的屏蔽效应

Proceedings of IEEE Electrical Performance of Electronic Packaging Pub Date : 1993-10-20 DOI:10.1109/EPEP.1993.394597

H.-H. Chen, S. Chung

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引用次数: 3

摘要

采用模式匹配法和线路法分析了封装微带线路中膜片的屏蔽效应。分析比较了膜片的宽度和深度对主模和高阶模散射的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Shielding effect of a diaphragm in a packaged microstrip circuit

The shielding effect of a diaphragm in a packaged microstrip line is analyzed using the mode-matching method together with the method of lines. The influence of the width and the depth of the diaphragm on the scatterings of the dominant-mode and higher-order-mode incidences is analyzed and compared.<>

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Proceedings of IEEE Electrical Performance of Electronic Packaging

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