基于0.18µm工艺技术的18V LDMOS单事件烧坏效应研究

Langtao Chen, Xin Zhou, Ying Wang, Ying Kong, R. Xie, Ling Peng, Yantu Mo, M. Qiao, Bo Zhang
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摘要

本文研究了基于0.18µm工艺的18V横向扩散MOS (LDMOS)的单事件烧坏(SEB)效应。揭示了雪崩电离诱导的寄生双极导通和自维持机制。在早期阶段,重离子诱导的电离空穴注入p体(PB)区域,产生寄生双极导通。允许来自源的电子流向漏极,并对电场剖面施加调制。由于在漏极侧形成场峰,雪崩电离诱导空穴为寄生双极的基极电流提供了补充。寄生双极和雪崩之间的孔的正反馈是造成SEB效应的原因。提出了多次植入辐射硬化技术,以降低PB区电阻,抑制寄生双极打开,同时消除对阈值电压的影响。
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Study on Single Event Burnout Effect for 18V LDMOS Based on 0.18µm Process Technology
In this paper, single event burnout (SEB) effect is investigated for 18V Lateral-diffused MOS (LDMOS) based on 0.18µm process technology. The SEB mechanism is revealed that parasitic bipolar turn-on and the self-maintaining induced by avalanche ionization. At early stage, heavy ion induced ionized holes inject into the P-body (PB) region, giving rise to the parasitic bipolar turn-on. Electrons from the source are allowed to flow to the drain, and exert modulation on electric field profile. Due to field peak formed at drain side, avalanche ionization induced holes provide a supplement for base current of the parasitic bipolar. A positive feedback of holes between the parasitic bipolar and avalanche is responsible for the SEB effect. Multi-implantation radiation hardening technology is proposed to reduce PB region resistance and suppress parasitic bipolar opened, while eliminate the impact on threshold voltage.
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